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Ultra-thin 3D Multi-Die Integration Technology with SJ Semi

3D Multi-Die Integration Technology

SJ Semi | 3D Multi-Die Integration Tech | Middle-End-Of-Line (MEOL) | Enterprise

3D Multi-Die Integration Technology
3D Multi-Die Integration Technology

SJSemi, which was established in August 2014, seeks to provide Middle-End-Of-Line (MEOL) manufacturing and testing services as well as to provide cutting-edge 3D Multi-Die Integration technology and solutions. It is dedicated to offering a simple, one-stop service to provide premium chips for both domestic and foreign consumers, as well as to supporting their improvement in global competitiveness.

Features

  • Registered capital: $830,000,000
  • Cleanroom\s35000m²
  • Team up with a seasoned engineering crew
  • ISO, AEO, and other certifications for systems

In short, utilize the SmartAiP technology platform to achieve high density, high integration, and ultra-thin 3D integration.

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